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This Insulation is a foil-faced Polyisocyanurate (PIR) insulation board. The PIR board is formed by a continuous foaming process, which gives the board its tight cell structure and bonds the facing to the foam. After foaming the boards are cut to size and left to cure.

The PIR core of the insulation boards has an extremely low thermal conductivity, making the required thickness of insulation less than for most other insulants. The foil laminate facings of these boards can also contribute to improved thermal performance: the low emissivity surface of the reflective foil can cut radiation heat transfer across an adjoining air space.
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